USB 2.0 in today's market has become the standard and most popular external connectivity solution, but mainboard manufacturers are pushing USB 3.0 with every major player offering boards with the additional standard. The current solutions are not realized through the chipset, but with the use of an external IC - usually from NEC at the moment. Vantec is ready with their NexStar 3 SuperSpeed series, which takes advantage of the USB 3.0 benefits. We had the pleasure of reviewing their 3.5 inch enclosure with the new connection flavor here and today we take a look at the new revision of their 2.5" enclosure - the "NexStar USB SuperSpeed 2.5" USB 3.0" enclosure.